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CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Qualcomm Multiple Chipsets · in CISA KEV since 2023-12-05
2023-12-05added to KEV
2023-12-26federal remediation due date
0.69%EPSS exploit probability (30 days) 51.5th percentile
7.8 HIGHCVSS 3.1
Unknownknown ransomware use
0days from NVD publication to KEV
What it is
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Required action (CISA)
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
| CWE | CWE-416 |
|---|---|
| CVSS vector | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
| NVD published | 2023-12-05 (Analyzed) |
Original records: NVD · CISA KEV · JSON: /api/cve/CVE-2023-33063.json · all KEV CVEs
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Get the full file: Exploited Vulnerabilities Brief – September 2026 ($29): this month's KEV additions ranked by EPSS, ransomware use and due date, ready to hand to a patch team. Checkout by Polar.